2.5D / 3D Packaging

Samsung launches advanced 2.5D chip-packaging technology, I-Cube4

2.5D vs Fan-out Chip on Substrate

Packaging options and advances for digital ICs

Do you need an automated ESD verification methodology for 2.5D/3D ICs? If so, read on… - Design with Calibre

Semicap Primer: Packaging History and Primer

IEEE IRPS - IRPS 2018 Focus session on 3D Integration and Advanced Packaging With diminishing returns from traditional transistor scaling further improvements in power and performance of

Heterogeneous 2.5D and 3D Integration for Securing Hardware and Data

3D IC and 2.5 D IC Packaging Industries- in-Depth Analysis

Asia Pacific 3D IC and 2.5D IC Packaging Market Size to 2029

Plasma Etch and Deposition Solutions for 2.5D/3D Packaging

2.5D IC Integration

April, 2014

Advanced 2.5D/3D Packaging Roadmap - SemiWiki