Process flow of the mixed-signal 3D-IC with via-last/backside-via
![Process flow of the mixed-signal 3D-IC with via-last/backside-via](https://www.researchgate.net/publication/335360939/figure/fig2/AS:795087986491392@1566575156673/Process-flow-of-the-mixed-signal-3D-IC-with-via-last-backside-via-TSV-process.png)
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Process flow of the mixed-signal 3D-IC with via-last/backside-via TSV
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Fabrication process flow for TSV interposer employing bottom-up
![](https://www.researchgate.net/publication/335360939/figure/fig2/AS:795087986491392@1566575156673/Process-flow-of-the-mixed-signal-3D-IC-with-via-last-backside-via-TSV-process.png)
Process flow of the mixed-signal 3D-IC with via-last/backside-via TSV